Typical environmental test of plate components: temperature shock, rapidtemperature change, condensation, mechanical shock, mechanical vibration, hightemperature and high humidity, etc.;
Non-destructive testing analysis: X-ray fluoroscopy, high-resolution CTimaging, acoustic scanning microscope, infrared thermal imaging, etc.;
Electrical performance testing: surface insulation resistance (SIR),volume resistivity, breakdown strength, dielectric strength, etc.;
Welding quality and mechanical performance analysis: chip clipper, bondingtape tension, cutting board/reflow stress and strain analysis, dyeing andpenetration, etc.;
Slicing and sample preparation of plate components: automatic cutting,grinding, polishing, micro-etching, etc.;
Solder joint defect detection: stereo microscope, metallographicmicroscope, large depth of field microscope, scanning electron microscope,etc.;
Assembly material composition detection: EDX, AES, secondary ion massspectrometry SIMS, infrared spectroscopy, chromatography, mass spectrometry;
Cleanliness detection: ion chromatography, conductivity equivalent method,etc.
Thermomechanical performance analysis: differential scanning calorimetry,thermogravimetric analysis, thermal stress test, hot oil test, etc.