3. The Future of PCB Layers and SMT
As electronic products become smaller and more integrated, multi-layer PCBs will become the norm. To meet this demand, SMT processes will continue to evolve. Key areas of focus include:4. Conclusion
The growing number of PCB layers presents significant challenges to SMT processes. To address these challenges, manufacturers must continually explore new technologies and processes. Additionally, investing in skilled personnel is crucial for handling the complexities of multi-layer PCB production.